Products

• Xilinx Virtex-7 FPGA XC7VX485T
• 3U VPX (VITA 46) module
• FMC-compliant carrier card (VITA 57) with High Pin Count (HPC) connector
• Freescale QorIQ P1010 processor with one Power Architecture® e500 core at up to 800 MHz
• Up to 512 MB of DDR3L-800 ECC SDRAM for P1010
• Up to 16 GB of SPI flash (with redundancy) for P1010
• Up to 1 GB of NAND flash for P1010
• Four channels of x32 DDR3L SDRAM, up to 1 GB each for FPGA
• 128 MB of user NOR flash for FPGA
• LVDS and high-speed GTX transceiver connectivity between FPGA and FMC
• One MicroSD socket
• x1 PCI Express P1010 to FPGA interconnect
• Two SerDes Gigabit Ethernet P1 fabric interconnects (P1010)
• Optional 10/100/1000BASE-T Ethernet port (P1010)
• Eight high-speed GTX lanes to FMC
• Eleven high-speed GTX lanes to P1 fabric interconnect
• Up to two RS-232/422/485 serial P2 ports (P1010)
• One USB 2.0 port (P1010)
• FPGA Development Kit (FDK)
• Linux BSP

FPGA

• Xilinx Virtex-7 for high-performance logic and DSP applications
• Up to 4 GB of DDR3L SDRAM in four channels
• 128 MB of user NOR flash

Supported FPGAs

• Xilinx Virtex-7 XC7VX330T
• Xilinx Virtex-7 XC7VX415T
• Xilinx Virtex-7 XC7VX485T (default)
• Xilinx Virtex-7 XC7VX690T
• Support for commercial and industrial temperature as well as -1, -2, -3 speed grades

FMC (VITA 57)

• FPGA LVDS I/O
• x8 GTX transceivers
• FPGA and processor GPIO via I²C expanders
• VPX GPIO
• RS-232/485 serial ports
• SPI and I²C interfaces
• Support for 1.8 V, 1.5 V, 1.2 V, and 1.35 V VADJ

Processor

• Freescale QorIQ P1010 processor
• Power Architecture® e500 core at up to 800 MHz
• 256 kB L2 cache
• Up to 512 MB of DDR3L-800 ECC SDRAM
• Up to 16 MB of NOR flash (with redundancy)
• Up to 1 GB of NAND flash
•  

VPX (VITA 46) P1 I/O

• Up to x8 PCI Express P1.A
• Three additional GTX lanes
• Two SerDes Gigabit Ethernet ports (or one SerDes port out P1 and one 10/100/1000BASE-T port out P2)

VPX (VITA 46) P2 I/O

• One 10/100/1000BASE-T port (when two SerDes Gigabit Ethernet P1 ports are not used)
• Up to two RS-232/422/485 serial ports
• One USB 2.0 port
• 3.3 V GPIO signals
• FGPA LVDS GPIO
• P1010 GPIO
• FMC GPIO

Development Support

• X-ES FPGA Development Kit (FDK)
• Linux BSP

Physical Characteristics

• 3U VPX-REDI conduction- or air-cooled form factor
• Dimensions: 100 mm x 160 mm
• 0.8 in. pitch without solder-side cover
• 0.85 in. and 1.0 in. pitch with solder-side cover

Environmental Requirements

Contact factory for appropriate board configuration based on environmental requirements.

• Supported ruggedization levels (see the X-ES Ruggedization Chart): 1, 3, 5
• Conformal coating available as an ordering option

Power Requirements

• Power will vary based on configuration and usage.