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XCalibur4640


Overview

Intel® Xeon® D Processor-Based 6U VPX Module with Quad 10GbE and Dual XMC/PMC Sites

The XCalibur4640 from Extreme Engineering is a high-performance, 6U OpenVPX™, multiprocessing, single board computer based on the Intel® Xeon® D (formerly Broadwell-DE) processor.

The XCalibur4640 provides up to 32 GB of DDR4-2133 ECC SDRAM in two channels, two XMC/PrPMC slots, and up to 128 GB of SATA NAND flash. The board also supports five Gigabit Ethernet ports, four SATA ports, three USB 2.0 ports, one USB 3.0 port, and up to four RS-232/422/485 serial ports out the front panel and/or backplane.
 

Technical

  • Supports Intel® Xeon® D processors (formerly Broadwell-DE)
  • 6U VPX (VITA 46) module
  • VITA 46.11 Tier 1 and Tier 2 IPMI Controller (IPMC)
  • Compatible with multiple OpenVPX™ (VITA 65) profiles
  • Rugged Enhanced Design Implementation (REDI) per VITA 48
  • Conduction or air cooling
  • Supports two XMC/PrPMC modules
  • Eight Xeon®-class cores in a single, power-efficient SoC package (available now)
  • 12 or 16 Xeon®-class cores in a single, power-efficient SoC package (available Q1 2016)
  • Extended temperature Intel® Xeon® D processors (available Q1 2016)
  • Up to 32 GB of DDR4-2133 ECC SDRAM in two channels
  • Larger densities of DDR4-2133 ECC SDRAM are available
  • Up to 128 GB of onboard SATA NAND flash
  • Four 10 Gigabit Ethernet ports and five Gigabit Ethernet ports
  • Four x4, two x8, or one x16 Gen3-capable PCI Express ports from switch to backplane
  • Four SATA ports
  • Three USB 2.0 ports to the back panel and one optional USB 3.0 port to the front panel
  • Up to four RS-232/422/485 serial ports
  • Wind River VxWorks BSP
  • X-ES Enterprise Linux (XEL) BSP
  • Contact Sarsen regarding availability of Green Hills INTEGRITY, QNX Neutrino, and LynuxWorks LynxOS BSPs

Specifications

Processor

  • Intel® Xeon® D (formerly Broadwell-DE)
  • Eight Xeon®-class cores in a single, power-efficient SoC package (available now)
  • 12 or 16 Xeon®-class cores in a single, power-efficient SoC package (available Q1 2016)
  • Extended temperature Intel® Xeon® D processors (available Q1 2016)


Memory

  • Up to 32 GB of DDR4-2133 ECC SDRAM in two channels
  • Up to 128 GB of NAND flash
  • 64 MB NOR boot flash
  • 64 kB EEPROM


OpenVPX™

  • VITA 46.11 (System Management on VPX)
  • Compatible with multiple OpenVPX™ (VITA 65) profiles
  • Four 10 Gigabit Ethernet ports to P1
  • Configurable x16 PCI Express Gen3-capable port to P2
  • Two 10/100/1000BASE-T Ethernet ports
  • XMC and PMC I/O to P3, P4, P5, and P6


PrPMC

  • PCI (32-bit, 66/33 MHz)
  • Pn4 I/O to VPX connectors per VITA 46.9 P64s


XMC

  • x8 PCI Express Gen3-capable port to J15 and J25
  • Pn6 I/O to VPX connectors per VITA 46.9 X38s+X12d+X8d


Front Panel I/O (Optional)

  • One 10/100/1000BASE-T Ethernet port
  • One USB 3.0 port
  • One RS-232/422/485 serial port
  • General-purpose LEDs


Back Panel I/O

  • Four SATA ports capable of 6 Gb/s
  • Three USB 2.0 ports
  • Up to four RS-232/422/485 serial ports
  • Pn4 and Pn6 I/O per VITA 46.9
  • Two 10/100/1000BASE-T Gigabit Ethernet ports
  • Four 10 Gigabit Ethernet SerDes ports
  • Two 1000BASE-BX Ethernet ports


Additional Features

  • Non-volatile memory write protection
  • Optional Trusted Platform Module (TPM)
  • VITA 46.11 Tier 1 and Tier 2 IPMI Controller (IPMC)
  • IEEE 1588 support (optional)


Software Support

  • Wind River VxWorks BSP
  • X-ES Enterprise Linux (XEL) BSP
  • Call for availability of Green Hills INTEGRITY, QNX Neutrino, and LynuxWorks LynxOS BSPs


Physical Characteristics

  • 6U VPX-REDI conduction- or air-cooled form factor
  • Dimensions: 233 mm x 160 mm
  • 0.8 in. pitch
  • 1.0 in. pitch Two-Level Maintenance (2LM)


Environmental Requirements

  • Supported ruggedisation levels (see the X-ES Ruggedization Chart): 1, 3, 5
  • Conformal coating available as an ordering option
  • Thermal performance will vary based on CPU frequency and application


Power Requirements

  • Power will vary based on configuration and usage. Please call to discuss.

Technical documents

Ordering information

There are a number of different configurations available. Please contact Sarsen Technology to discuss your application.

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