Products
XPedite7450
Overview
Intel® Core™ i7 Processor-Based Rugged Basic COM Express® Module
The XPedite7450 from Extreme Engineering Solutions (X-ES) is an enhanced, Type 6 COM Express™ module based on the 2nd generation Intel® Core™i7 processor or 3rd generation Intel® Core™i7 processor and Intel QM67 chipset.
The small footprint and standards-based form factor make the XPedite7450 perfect for portable and rugged environments, and for a wide range of commercial, industrial, and military applications.
Wind River VxWorks and Linux Board Support Packages (BSPs) are available, as well as Microsoft Windows drivers.
Technical
- Supports 2nd generation and 3rd generation Intel® Core™ i7 processors
- Quad- or dual-core processor with Intel® Hyper-Threading Technology
- Standard COM Express® Basic form factor with ruggedisation enhancements
- COM Express® enhanced Type 6 pinout
- Up to 16 GB of DDR3-1600 ECC SDRAM in two channels
- Up to 32 GB of NAND flash
- 16 lanes of PCI Express from CPU. Default configuration is two x8 lanes.
- Six lanes of PCI Express from Intel® QM67 chipset. Default configuration is one x4, two x1 lanes.
- Two 10/100/1000BASE-T Gigabit Ethernet ports
- Five USB 2.0 ports
- Five SATA ports
- Two digital display interfaces (DP/DVI/HDMI)
- One VGA interface
- Intel® High Definition Audio port
- Wind River VxWorks BSP
- Linux BSP
- Microsoft Windows drivers
- Contact Sarsen for availability of Green Hills INTEGRITY, QNX Neutrino, and LynuxWorks LynxOS BSPs
Specifications
Processor
- Quad- or dual-core Intel® Core™ i7
- Intel® Turbo Boost Technology
- Intel® Hyper-Threading Technology
- AVX instruction set extensions
- Integrated with Intel® QM67 chipset
- Dual-channel integrated memory controller
- Integrated high-performance 3D graphics controller
Quad-Core Processor Configurations
- Core™ i7-3612QE: 2.1 GHz, 6 MB cache
Dual-Core Processor Configurations
- Core™ i7-2655LE: 2.2 GHz, 4 MB cache
- Core™ i7-2610UE: 1.5 GHz, 4 MB cache
- Core™ i7-3555LE: 2.5 GHz, 4 MB cache
- Core™ i7-3517UE: 1.7 GHz, 4 MB cache
Memory
- Up to 16 GB of DDR3-1600 ECC SDRAM in two channels
- Up to 32 GB of NAND flash
Graphics
- Integrated high-performance 3D graphics controller
- Two digital display interfaces (DP/DVI/HDMI)
- VGA
COM Express®
- Basic form factor (95 mm x 125 mm)
- Enhanced Type 6 pinout
- Replaces LVDS with second Ethernet port and one SATA port capable of 3 Gb/s
- Adds non-volatile write protect
- Adds two external interrupts
Interface
- Five USB 2.0 ports
- Five SATA ports capable of 3 Gb/s
- Intel® High Definition Audio port
- 16 lanes of PCI Express from CPU. Default configuration is two x8 lanes.
- Six lanes of PCI Express from Intel® QM67 chipset. Default configuration is one x4, two x1 lanes.
- Two serial ports
- LPC
- SMB
- I²C
Ruggedization and Reliability
- Class III PCB fabrication and assembly
- Soldered DDR3 ECC SDRAM
- Tin whisker mitigation
- Designed and tested for extended solder joint reliability
- Additional mounting holes for rugged and conduction-cooled environments
- BIT support
Security and Management
- Optional Trusted Platform Module (TPM)
- Non-volatile memory write protection
Software Support
- Wind River VxWorks BSP
- Linux BSP
- Microsoft Windows drivers
- Contact factory for availability of Green Hills INTEGRITY, QNX Neutrino, and LynuxWorks LynxOS BSPs
Physical Characteristics
- Dimensions: 95 mm x 125 mm
Technical documents
Ordering information
LOG IN /
